Image shown is a representation only.
Exact specifications should be obtained from the product data sheet.
Product Attributes
| Type | Description |
|---|---|
| Category | FPGAs (Field Programmable Gate Array) |
| Manufacturer | AMD |
| Series | * |
| Package | Bulk |
| Product Status | Active |
| Number of LABs/CLBs | 1536 |
| Number of Logic Elements/Cells | 6912 |
| Total RAM Bits | 65536 |
| Number of I/O | 316 |
| Number of Gates | 322970 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 432-MBGA (40x40) |
| Part Status | Active |
Documents & Media
| Resource Type | Link |
|---|---|
| Datasheet | AMD XCV300-4BG432C4307 Datasheet |
| Product Image | View Large Image |
Environmental & Export Classifications
| Attribute | Description |
|---|---|
| RoHS Status | |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Product Description
The XCV300-4BG432C4307 is a Field Programmable Gate Array (FPGA) manufactured by AMD. Integrated Circuit Field Programmable Gate Array 316 I/O in 432-Pin BGA Package, housed in a compact 432-MBGA (40x40) package, with 2.375V ~ 2.625V supply voltage. Originally developed by Xilinx.
Key Technical Specifications
- Supply Voltage: 2.375V ~ 2.625V
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting: Surface Mount
- Package: 432-LBGA Exposed Pad, Metal
- Device Package: 432-MBGA (40x40)
Packaging: factory Bulk or Custom Quantity · ESD-shielded, vacuum-sealed MBB to MSL standards.
Fulfillment: MPN and Date Code verified on inbound · datasheet and compliance documents available · RFQ answered within 24 hours.
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