Image shown is a representation only.
Exact specifications should be obtained from the product data sheet.
Product Attributes
| Type | Description |
|---|---|
| Category | System On Chip (SoC) |
| Manufacturer | AMD |
| Package | Tray |
| Product Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 1024-BGA (31x31) |
| Part Status | Active |
Documents & Media
| Resource Type | Link |
|---|---|
| Datasheet | AMD XCVM1302-2HSINBVB1024 Datasheet |
| Product Image | View Large Image |
Environmental & Export Classifications
| Attribute | Description |
|---|---|
| RoHS Status | RoHS Compliant |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Product Description
The XCVM1302-2HSINBVB1024 is a System-on-Chip (SoC) with Programmable Logic manufactured by AMD. Integrated Circuit Versalprime Acap Field Programmable Gate Array in 1024-Pin BGA Package, housed in a compact 1024-BGA (31x31) package. Originally developed by Xilinx.
Key Technical Specifications
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package: 1024-BFBGA
- Device Package: 1024-BGA (31x31)
- RoHS Compliant
Packaging: factory Tray or Partial Tray · ESD-shielded, vacuum-sealed MBB to MSL standards.
Fulfillment: MPN and Date Code verified on inbound · datasheet and compliance documents available · RFQ answered within 24 hours.
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