Image shown is a representation only.
Exact specifications should be obtained from the product data sheet.
Product Attributes
| Type | Description |
|---|---|
| Category | System On Chip (SoC) |
| Manufacturer | AMD |
| Package | Tray |
| Product Status | Not For New Designs |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Supplier Device Package | 900-FCBGA (31x31) |
| Part Status | Active |
Documents & Media
| Resource Type | Link |
|---|---|
| Datasheet | AMD XCZU5EG-L2FBVB900E Datasheet |
| Product Image | View Large Image |
Environmental & Export Classifications
| Attribute | Description |
|---|---|
| RoHS Status | RoHS Compliant |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Product Description
The XCZU5EG-L2FBVB900E is a System-on-Chip (SoC) with Programmable Logic manufactured by AMD. Integrated Circuit System On Chip Cortex-A53 in 900-Pin BGA Package, housed in a compact 900-FCBGA (31x31) package. Originally developed by Xilinx.
Key Technical Specifications
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package: 900-BBGA, FCBGA
- Device Package: 900-FCBGA (31x31)
- RoHS Compliant
Packaging: factory Tray or Partial Tray · ESD-shielded, vacuum-sealed MBB to MSL standards.
Fulfillment: MPN and Date Code verified on inbound · datasheet and compliance documents available · RFQ answered within 24 hours.
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