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LPC1850FBD208,551 NXP USA Inc.

IC MCU 32BIT ROMLESS 208LQFP

In Stock RoHS
LPC1850FBD208,551

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Exact specifications should be obtained from the product data sheet.

Manufacturer Product Number LPC1850FBD208,551
Manufacturer NXP USA Inc.
NavitasChip Part Number NAVI-3430909
Description IC MCU 32BIT ROMLESS 208LQFP
Spec 208-LQFP
Package Tray
Datasheet Datasheet

Product Attributes

Type Description
Category Microcontrollers
Manufacturer NXP USA Inc.
Package Tray
Product Status Obsolete
Core Processor ARM® Cortex®-M3
Core Size 32-Bit
Speed 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O 142
Program Memory Type ROMless
RAM Size 200K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Supplier Device Package 208-LQFP (28x28)
Part Status Active

Documents & Media

Resource Type Link
Datasheet NXP USA Inc. LPC1850FBD208,551 Datasheet
Product Image View Large Image

Environmental & Export Classifications

Attribute Description
RoHS Status RoHS Compliant
REACH Status REACH Unaffected
ECCN EAR99

Product Description

The LPC1850FBD208,551 is a Microcontroller (MCU) manufactured by NXP USA Inc. (NXP). Integrated Circuit Microcontroller 32bit Romless in 208-Pin LQFP Package, housed in a compact 208-LQFP (28x28) package.

Struggling with allocation constraints? Our global sourcing network ensures reliable supply for your projects.

Key Technical Specifications

  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting: Surface Mount
  • Package: 208-LQFP
  • Device Package: 208-LQFP (28x28)
  • RoHS Compliant

Applications

Designed for:

  • embedded systems
  • IoT devices
  • industrial automation
  • industrial control
  • smart home

Why Choose NavitasChip for LPC1850FBD208,551?

NavitasChip offers cost-saving procurement for the LPC1850FBD208,551 and thousands of other electronic components.

  • Availability: Ready to Ship
  • Packaging: Available in factory Tray or Partial Tray. All custom quantities are professionally repackaged with ESD Shielding and Vacuum-Sealed MBB (Moisture Barrier Bags) in strict adherence to MSL standards.
  • Fast Shipping: Ships from Shenzhen / Hong Kong / Singapore via DHL/FedEx/UPS
  • Quality Assurance: Inbound check with MPN and Date Code review
  • Technical Support: Datasheet and compliance documentation available

Global Shipping

Trusted by procurement managers in Singapore, Vietnam, and across the globe.

LPC1850FBD208,551 - Check our competitive price now.

Spot Buy Note

Stock quantities are dynamic and updated in real-time. For large quantity orders (1,000+ units), please contact us for real-time stock verification and custom pricing.

Shopping Guide

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In Stock: 924 pcs

Ready to ship immediately

Lead Time

18 Weeks

Factory standard

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