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LPC3154FET208,551 NXP USA Inc.

IC MCU 16/32BIT ROMLESS 208TFBGA

In Stock RoHS
LPC3154FET208,551

Image shown is a representation only.
Exact specifications should be obtained from the product data sheet.

Manufacturer Product Number LPC3154FET208,551
Manufacturer NXP USA Inc.
NavitasChip Part Number NAVI-2296539
Description IC MCU 16/32BIT ROMLESS 208TFBGA
Spec 208-TFBGA
Package Tray
Datasheet Datasheet

Product Attributes

Type Description
Category Microcontrollers
Manufacturer NXP USA Inc.
Package Tray
Product Status Obsolete
Core Processor ARM9®
Core Size 16/32-Bit
Speed 180MHz
Connectivity EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals DMA, I2S, LCD, PWM, WDT
Number of I/O 10
Program Memory Type ROMless
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.6V
Data Converters A/D 3x10b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Supplier Device Package 208-TFBGA (12x12)
Part Status Active

Documents & Media

Resource Type Link
Datasheet NXP USA Inc. LPC3154FET208,551 Datasheet
Product Image View Large Image

Environmental & Export Classifications

Attribute Description
RoHS Status RoHS Compliant
REACH Status REACH Unaffected
ECCN EAR99

Product Description

The LPC3154FET208,551 is a Microcontroller (MCU) manufactured by NXP USA Inc. (NXP). Integrated Circuit Microcontroller 16/32bit Romless in 208-Pin BGA Package, housed in a compact 208-TFBGA (12x12) package.

In today's market, challenging Target Price (TP) requirements can affect many manufacturers. NavitasChip offers dependable alternatives.

Key Technical Specifications

  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting: Surface Mount
  • Package: 208-TFBGA
  • Device Package: 208-TFBGA (12x12)
  • RoHS Compliant

Applications

Critical part of:

  • embedded systems
  • IoT devices
  • consumer electronics
  • professional equipment

Why Choose NavitasChip for LPC3154FET208,551?

NavitasChip offers competitive market pricing for the LPC3154FET208,551 and thousands of other electronic components.

  • Availability: In Inventory
  • Packaging: Available in factory Tray or Partial Tray. All custom quantities are professionally repackaged with ESD Shielding and Vacuum-Sealed MBB (Moisture Barrier Bags) in strict adherence to MSL standards.
  • Fast Shipping: Ships from Shenzhen / Hong Kong / Singapore via DHL/FedEx/UPS
  • Quality Assurance: Inbound check with MPN and Date Code review
  • Technical Support: Datasheet and compliance documentation available

Global Shipping

Fast LPC3154FET208,551 delivery to New Zealand and Australia via DHL, FedEx, and UPS.

LPC3154FET208,551 - Upload your BOM for fast pricing.

Spot Buy Note

Stock quantities are dynamic and updated in real-time. For large quantity orders (1,000+ units), please contact us for real-time stock verification and custom pricing.

Shopping Guide

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In Stock: 1,067 pcs

Ready to ship immediately

Lead Time

18 Weeks

Factory standard

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