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MCF5307FT66B NXP USA Inc.

IC MCU 32BIT ROMLESS 208FQFP

In Stock RoHS
MCF5307FT66B

Image shown is a representation only.
Exact specifications should be obtained from the product data sheet.

Manufacturer Product Number MCF5307FT66B
Manufacturer NXP USA Inc.
NavitasChip Part Number NAVI-506189
Description IC MCU 32BIT ROMLESS 208FQFP
Spec 208-BFQFP
Package Tray
Datasheet Datasheet

Product Attributes

Type Description
Category Microcontrollers
Manufacturer NXP USA Inc.
Package Tray
Product Status Obsolete
Core Processor Coldfire V3
Core Size 32-Bit
Speed 66MHz
Connectivity EBI/EMI, I2C, UART/USART
Peripherals DMA, POR, WDT
Number of I/O 16
Program Memory Type ROMless
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Supplier Device Package 208-FQFP (28x28)
Part Status Active

Documents & Media

Resource Type Link
Datasheet NXP USA Inc. MCF5307FT66B Datasheet
Product Image View Large Image

Environmental & Export Classifications

Attribute Description
RoHS Status
REACH Status REACH Unaffected
ECCN EAR99

Product Description

The MCF5307FT66B is a Microcontroller (MCU) manufactured by NXP USA Inc. (NXP). Integrated Circuit Microcontroller 32bit Romless 208fqfp, housed in a compact 208-FQFP (28x28) package.

In today's market, production line down can affect many manufacturers. NavitasChip offers dependable alternatives.

Key Technical Specifications

  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting: Surface Mount
  • Package: 208-BFQFP
  • Device Package: 208-FQFP (28x28)

Applications

Designed for:

  • embedded systems
  • industrial automation
  • professional equipment
  • wearable devices
  • smart home

Why Choose NavitasChip for MCF5307FT66B?

NavitasChip offers supply gap bridging when factory lead times exceed 50 weeks for the MCF5307FT66B and thousands of other electronic components.

  • Availability: Ready to Ship
  • Packaging: Available in factory Tray or Partial Tray. All custom quantities are professionally repackaged with ESD Shielding and Vacuum-Sealed MBB (Moisture Barrier Bags) in strict adherence to MSL standards.
  • Fast Shipping: Ships from Shenzhen / Hong Kong / Singapore via DHL/FedEx/UPS
  • Quality Assurance: Inbound check with MPN and Date Code review
  • Technical Support: Datasheet and compliance documentation available

Global Shipping

Multiple origin options for MCF5307FT66B to optimize delivery time and customs clearance.

MCF5307FT66B - Contact our sales team.

Spot Buy Note

Stock quantities are dynamic and updated in real-time. For large quantity orders (1,000+ units), please contact us for real-time stock verification and custom pricing.

Shopping Guide

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In Stock: 949 pcs

Ready to ship immediately

Factory Lead Time

Weeks, typically

Ships today, skip the wait

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