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Exact specifications should be obtained from the product data sheet.
| Manufacturer Product Number | R9A06G037GNP#AA0 |
| Manufacturer | Renesas Electronics Corporation |
| NavitasChip Part Number | NAVI-18162542 |
| Description | SOC PLC MODEM LSI SMART GRID ASS |
| Spec | 64-VFQFN Exposed Pad |
| Package | Tray |
| Datasheet | Datasheet |
Product Attributes
| Type | Description |
|---|---|
| Category | System On Chip (SoC) |
| Manufacturer | Renesas Electronics Corporation |
| Package | Tray |
| Product Status | Active |
| Architecture | DSP, MCU |
| Core Processor | ARM® Cortex®-M3 |
| RAM Size | 128kB |
| Peripherals | PWM |
| Connectivity | CSI, I2C, UART |
| Speed | 138MHz |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Supplier Device Package | 64-HVQFN (9x9) |
| Part Status | Active |
Documents & Media
| Resource Type | Link |
|---|---|
| Datasheet | Renesas Electronics Corporation R9A06G037GNP#AA0 Datasheet |
| Product Image | View Large Image |
Environmental & Export Classifications
| Attribute | Description |
|---|---|
| RoHS Status | RoHS Compliant |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Product Description
The R9A06G037GNP#AA0 is a System-on-Chip (SoC) with Programmable Logic manufactured by Renesas Electronics Corporation (Renesas). System On Chip Plc Modem Lsi Smart Grid Ass, housed in a compact 64-HVQFN (9x9) package.
Key Technical Specifications
- Operating Temperature: -40°C ~ 85°C (TA)
- Package: 64-VFQFN Exposed Pad
- Device Package: 64-HVQFN (9x9)
- RoHS Compliant
Packaging: factory Tray or Partial Tray · ESD-shielded, vacuum-sealed MBB to MSL standards.
Fulfillment: MPN and Date Code verified on inbound · datasheet and compliance documents available · RFQ answered within 24 hours.
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Stock quantities are dynamic and updated in real-time. For large quantity orders (1,000+ units), please contact us for real-time stock verification and custom pricing.
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